Materials Science In Semiconductor Processing

Materials Science In Semiconductor Processing英文簡介

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.

Materials Science In Semiconductor Processing中文簡介

《Materials Science In Semiconductor Processing》是一本由ELSEVIER SCI LTD出版商出版的專業(yè)工程技術期刊，該刊創(chuàng)刊于1998年，刊期Bimonthly，該刊已被國際權威數(shù)據(jù)庫SCI、SCIE收錄。在中科院最新升級版分區(qū)表中，該刊分區(qū)信息為大類學科：工程技術 3區(qū)，小類學科：工程：電子與電氣 3區(qū)；材料科學：綜合 3區(qū)；物理：應用 3區(qū)；物理：凝聚態(tài)物理 3區(qū)；在JCR（Journal Citation Reports）分區(qū)等級為Q2。該刊發(fā)文范圍涵蓋工程：電子與電氣等領域，旨在及時、準確、全面地報道國內(nèi)外工程：電子與電氣工作者在該領域取得的最新研究成果、工作進展及學術動態(tài)、技術革新等，促進學術交流，鼓勵學術創(chuàng)新。2021年影響因子為4.644，平均審稿速度約1.7個月。

中科院分區(qū)最新升級版（當前數(shù)據(jù)版本：2021年12月最新升級版）

大類學科	分區(qū)	小類學科	分區(qū)	Top期刊	綜述期刊
工程技術	3區(qū)	ENGINEERING, ELECTRICAL & ELECTRONIC 工程：電子與電氣 MATERIALS SCIENCE, MULTIDISCIPLINARY 材料科學：綜合 PHYSICS, APPLIED 物理：應用 PHYSICS, CONDENSED MATTER 物理：凝聚態(tài)物理	3區(qū) 3區(qū) 3區(qū) 3區(qū)	否	否

JCR分區(qū)（當前數(shù)據(jù)版本：2021-2022年最新版）

JCR分區(qū)等級	JCR所屬學科	分區(qū)	影響因子
Q2	MATERIALS SCIENCE, MULTIDISCIPLINARY	Q2	4.644
	PHYSICS, APPLIED	Q2
	PHYSICS, CONDENSED MATTER	Q2
	ENGINEERING, ELECTRICAL & ELECTRONIC	Q2

期刊指數(shù)

影響因子	h-index	Gold OA文章占比	研究類文章占比	OA開放訪問	平均審稿速度
4.644	49	1.53%	98.85%	未開放	約1.7個月

IF值(影響因子)趨勢圖